The AEHR MAX-64000 is a semiconductor test system engineered for high-throughput functional and burn-in testing of integrated circuits and memory devices across multiple form factors. It delivers superior signal quality and power delivery while maintaining thermal uniformity, supporting everything from wafer-level testing to system-level PCB validation.
Technical Specifications
System Architecture & Electronics
• High-density signal and power architecture with full functional test capability
• Enables device function verification during burn-in cycles
• Superior signal quality and high current device power for test and burn-in operations
• High level of burn-in electronics integration for optimal resource allocation
Thermal Management
• Chambers feature high thermal capacity and uniformity with optimized airflow for package parts, modules, system-level devices, and PCBs
• Narrow and wide chamber options available for flexible production floor density and footprint requirements
• Liquid thermal control for high-power devices with heat transfer capability from wafers to thermal chuck
• Integrated iSocket solution for individual device control ranging from 5 to 100 Watts
Signal & Photonics Capability
• DiePak sensing technology for optical output measurement in silicon photonics devices such as VCSELs and LEDs, beyond electrical signal verification
Device Contacting
• Massively parallel contacting resources capable of connecting to billions of devices
• Proprietary full wafer single touchdown contactors, WaferPak contactors, DiePak carriers, and socket solutions
– Key Features
• Supports full wafers, singulated die, module panels, multi-die modules, system-level products, and complete PCBs
• Functional test during burn-in without compromising signal integrity
• Scalable architecture for high-density testing environments
– Typical Applications
• Silicon photonics IC burn-in and stabilization
• Silicon carbide (SiC) and gallium nitride (GaN) power semiconductor functional test and burn-in/cycling
• Optical devices, 2D and 3D sensors, flash memories, and magnetic sensors
• AI processor and accelerator high-power burn-in including wafer-level test
• Automotive ICs and industrial robotics applications
– Compatibility & Integration
The MAX-64000 integrates proprietary contacting and thermal technologies designed for seamless adaptation across diverse device architectures and production workflows.
