The Agilent HP 8153A LightWave Multimeter is a modular optical test platform built around a dual-channel mainframe for precision power, loss, and return loss measurements in fiber optic networks. Plug-in sensor and optical head modules integrate into the mainframe, enabling rapid configuration changes for laboratory and field deployment. The instrument combines a six-digit main display with an eight-character auxiliary display per channel, data acquisition memory for 500 results per channel, and HP-IB/SCPI control for automated test sequences.
Technical Specifications
Mainframe measurement range spans +30 dBm to -110 dBm. Calibration factor and reference offset adjust to ±200.000 dB. Data acquisition operates at ≥20 ms per point with selectable averaging from 20 ms to 60 minutes and total acquisition windows extending to 99:59:59 hours. HP-IB data transfer delivers single measurement results in 20 ms or 100 consecutive results in <800 ms. The instrument supports HP-IB function codes SH1, AH1, T6, L4, SR1, RL1, PP0, DC1, DT1, C0, and E2, plus SCPI command compatibility. Operating temperature range is 0 °C to +55 °C; storage extends to -40 °C to +70 °C. Humidity tolerance is <95% R.H. from 0 °C to +40 °C. Power input: AC 100–240 Vrms ±10%, 48–66 Hz, 35 VA maximum. Physical footprint is 89 mm H × 212.3 mm W × 355 mm D; net weight 2.5 kg. – Key Features • Dual-channel simultaneous measurement and display
• Modular plug-in architecture for configuration flexibility
• Memory-based data logging: 500 results per channel
• Extended acquisition times: up to 99+ hours continuous
• HP-IB and SCPI remote control for integration into ATE systems
• Wide dynamic range: +30 dBm to -110 dBm – Typical Applications Power meter configurations for transmitter and receiver characterization. Loss test set assembly for insertion loss and back-reflection analysis. Multi-channel simultaneous measurement in component and subsystem evaluation. – Compatibility & Integration Accepts optional sensor modules including Si photodiode heads (450–1020 nm) and InGaAs photodiode heads (800–1700 nm), as well as Ge optical head interfaces (900–1700 nm). Module warm-up time is 20 minutes. All modules mount directly into mainframe slots without external cabling.
