The Alltest ACW-323 Panel Walk-In chamber (Thermotron WP-323) is an environmental test chamber engineered for evaluation of large products, components, and materials across demanding climatic conditions. This 323 ft³ (9,147 L) walk-in system delivers precise temperature and humidity control through digital regulation, supporting applications in semiconductor, automotive, and aerospace industries where product reliability validation is critical.
Technical Specifications
Temperature Control:
• Single-stage refrigeration: −34°C to +85°C (−29°F to +185°F)
• Cascade refrigeration: −68°C to +85°C (−90°F to +185°F)
• Maximum temperature (urethane panel limit): +85°C (+185°F)
Humidity Control:
• Standard range: 20% to 95% RH; dewpoint +5°C to +65°C (+41°F to +149°F); maximum drybulb +70°C (+158°F)
• Optional low-humidity: 5% to 95% RH; dewpoint −10°C to +65°C (−14°F to +149°F); drybulb +5°C to +70°C (+41°F to +158°F)
• Digital temperature and humidity control system
Construction:
• 4 in. (10 cm) urethane insulation
• Cam-action speed locks with embedded steel straps for positive sealing and rigidity
• Interior: stainless steel or aluminum; exterior: patterned aluminum or painted finish
• Heavy-duty floor rated 600 lbs/ft² (2,929 kg/m²)
• Lightweight panels with locating pins and 90-degree corner posts
– Key Features
• Variable-speed airflow control for chamber velocity adjustment
• Pre-designed, pre-packaged conditioning modules with custom configuration options
• Locating pin alignment system ensures accurate panel fit
• Embedded steel structural reinforcement
– Optional Accessories
Electronic humidity sensor, door interlocks, low-humidity control, product temperature control, reinforced floors, multiple shelf configurations, water purification and recirculation, access ports, dry air purge, product dewpoint control, noise reduction package, serial communications panel, system monitor, and air-cooled condenser.
– Typical Applications
Semiconductor manufacturing, automotive component qualification, aerospace material evaluation, and environmental stress screening of large assemblies.
