The Emerson/Motorola MCP750 is a single-slot CompactPCI single board computer built on the PowerPC 750 32-bit microprocessor architecture. Operating at 400 MHz, it delivers the processing power and I/O integration required for embedded industrial control, communications, and mission-critical systems. The board combines a 1MB base flash footprint with configurable DRAM up to 256MB, dual Ethernet ports, four serial channels, USB connectivity, and CompactFlash support—all within a standard CompactPCI form factor.
Technical Specifications
• Processor: PowerPC 750 32-bit microprocessor, 400 MHz
• L1 Cache: 32KB Instruction / 32KB Data
• L2 Cache: 1MB
• System Memory: 16MB to 256MB ECC DRAM (60ns FPM, 50ns EDO)
• Flash Memory: 1MB base (main board) + 5MB to 9MB on-board; optional 4MB or 8MB upgrades
• Expansion: Single 32/64-bit PCI Mezzanine Card (PMC) slot
• CompactPCI Interface: 64-bit
• Ethernet: Intel 21140 controller, 10/100 Mb/s, RJ-45 front panel, DMA with PCI burst
• Serial Ports: Two 16550-compatible asynchronous; two configurable async/sync; two synchronous (HD-26)
• USB: Two ports
• Parallel Port: IEEE 1284 compliant
• Storage: EIDE controller, floppy disk controller, CompactFlash socket
• NVRAM: 8K x 8 with battery-backed time-of-day clock
• Timers: Four 32-bit timers; three watchdog timers with system reset trigger
• Debug: On-board monitor and self-test diagnostics
• Power Management: Doze, nap, sleep, and dynamic modes
– Physical & Environmental
• Form Factor: Single CompactPCI slot, 19.8mm (0.8 in.) width
• Dimensions: 233.4mm H × 80.0mm or 60.0mm D × 261.8mm front panel height
• PWB Rating: 94V-0 flammability
• Operating Temperature: −5°C to +55°C (forced-air cooling)
• Storage Temperature: −40°C to +85°C
– Key Features
• Single-slot CompactPCI deployment without secondary expansion overhead
• Quad serial channel configuration supports legacy and modern protocols
• Integrated Ethernet with DMA acceleration for throughput-intensive applications
• Watchdog timers enable autonomous system recovery in unattended deployments
• Dynamic power management reduces thermal load during idle periods
– Typical Applications
• Industrial process control and automation
• Telecommunications line cards and network appliances
• Military and avionics embedded computing
• Real-time data acquisition and field monitoring
