The IGC T1101-05-000-30 is a modular industrial computer component designed for gas flow control in demanding applications. It integrates substrate assembly, manifold assembly, and mounting components into a unified system for semiconductor manufacturing and process automation. The unit features a fanless design, accepts 1.5 in. (38.1 mm) C-seal surface-mount components, and operates continuously in harsh industrial environments.
## Technical Specifications
• **System Architecture:** Modular design with substrate assembly, manifold assembly, and mounting components
• **Component Compatibility:** Accepts 1.5 in. (38.1 mm) C-seal surface-mount components
• **Operating Temperature Range:** −20°C to +60°C ambient
• **Materials:** Stainless steel construction for industrial durability
• **Environmental Protection:** NEMA 4/IP65 rated front panel; resistant to sprayed water, humidity, and extreme dust
• **Cooling:** Fanless architecture
## Key Features
• **Connectivity:** Dual Gigabit Ethernet, USB, RS-232, and RS-485 interfaces
• **Mounting:** Panel-mount configuration
• **Gas Flow Control:** Purpose-designed for precise gas regulation in semiconductor processes
• **I/O Module Support:** Compatible with I-8K and I-87K series I/O modules, plus Ethernet and RS-485 I/O expansion
## Typical Applications
• Semiconductor manufacturing gas control systems
• Industrial process automation with 24/7 operation requirements
• Data acquisition and supervisory control in harsh environments
• Human Machine Interface (HMI) integration with real-time process monitoring
## Compatibility & Integration
The modular architecture supports flexible integration of standard hardware and flow control components. Multiple I/O module options enable distributed control across Ethernet and serial networks, making the system adaptable to existing industrial infrastructure.
