The Kontron/PEP CP604-PM is a CompactPCI single board computer engineered for demanding industrial and embedded applications requiring hot-swappable capability. This Peripheral Master (PM) variant enables board removal and replacement within a running system without operational disruption. Built around the Intel Mobile Pentium III processor (BGA 400/500/700/850 MHz), it delivers reliable computing power across harsh operating environments with extended temperature support.
## Technical Specifications
**Processor & Memory**
• Intel Mobile Pentium III: 400/500/700/850 MHz
• Up to 1 GB SDRAM/ECC PC100 directly soldered
• Optional 1 GB memory expansion via PMC slot sacrifice
• Maximum 2 GB SDRAM with optional ECC
• 256 kB FLASH (BIOS), 4 MB onboard Flash
**Graphics & Display**
• AGP VGA with CRT and LVDS output
• Onboard graphics unit with 2D/3D accelerator
• Optional external AGP 4x graphics card (SMI Cougar 3DR) with up to 32 MB DDR SDRAM, MPEG2/MPEG4 optimized
• Dual independent display support: DVI, CRT, dual LVDS
**Storage**
• 2.5″ EIDE device support with onboard mounting kit
• Optional flash-disk module or 2.5″ IDE-compatible hard disk within 4 HP form factor
**I/O & Connectivity**
• Two Fast Ethernet ports (10BaseT/100BaseTX)
• Four serial channels: COM1/2 (RS232/422/485 front panel), COM3/4 (rear I/O module)
• Two USB interfaces
• Parallel port (ECP/EPP)
• PS/2 keyboard and mouse
• Floppy disk controller
• PMC slot
• IPMI system management interface
• Optional rear panel modules (4 HP/8 HP): configurable COM, USB, Ethernet, VGA/LVDS, IDE, Fan sense monitoring
**Hot-Swap Architecture (CP604-PM)**
• Signal precharge and power ramping control
• Non-transparent PCI-PCI bridge isolating PM resources
• Automatic interrupt generation on board removal/insertion
• Safe removal LED indicator
• Hot-swap control and status registers
**Environmental**
• Operating temperature: -40°C to +85°C (extended range versions)
• Maximum case temperature: 100°C
• Low power consumption via 3.3 V and 1.5 V I/O technology
## Key Features
Hot-swappable Peripheral Master design enables live board replacement without system shutdown. Non-transparent bridge architecture isolates board resources, preventing cascading failures. Dual-display capability supports mixed analog/digital outputs. Optional multimedia expansion delivers hardware MPEG acceleration.
## Typical Applications
Mission-critical embedded systems, industrial automation controllers, network appliances, real-time computing platforms, field-deployed instrumentation requiring hot-swap availability.
## Compatibility & Integration
CompactPCI form factor. IPMI-compliant system management. AGP graphics expansion. PMC slot for additional I/O cards. Optional rear I/O modules customize connectivity without board redesign.
