The Orthodyne Orthodyne 20 is a large-wire ultrasonic bonder engineered for high-throughput semiconductor and power hybrid bonding applications. It processes wire diameters from 4 to 20 mils (125 to 500 microns) in fully automated sequences, delivering up to 600 devices per hour with over 98% yield. The single-wire approach eliminates the need for multiple smaller wires, reducing connection steps and bond failure risk.
Technical Specifications
• Bonding Technology: Ultrasonic
• Wire Diameter Range: 4 to 20 mils (125 to 500 microns)
• Throughput: Up to 600 devices per hour
• Bonding Yield: Over 98%
• Bonding Cycle Time: Approximately 1 second per sequence
• Wire Feed System: Automatic feed from 4-inch spool
• Ultrasonic Generator: Proprietary phase-lock circuit with automatic frequency correction and wide capture range; eliminates manual tuning
• Transducer Matching: Output circuit optimized for electrostrictive ceramic transducers
• Pre-Bond Delay: Ensures mechanical dampening before ultrasonic pulse application
• Wire Cutting: Patented Larrison bonding tools with unique cutoff method during bonding—no device damage or wire stress
• Device Positioning: Electronic circuitry with photocell control
• Operating Modes: Manual or semi-automatic; electronic lockout available to increase bonding rate
– Key Features
• Demand control through integrated output circuit and transducer design reduces yield variability across material parameter changes
• Automated bonding sequence: wire cutting, first bond, loop formation, second bond
• Three basic bonding tool configurations for diverse power device geometries
• Proprietary frequency correction eliminates frequency drift during operation
– Typical Applications
Semiconductor power devices and hybrid power assemblies requiring high-current, high-reliability interconnects in single-wire bonding formats.
– Compatibility & Integration
• Wire Material: 99.99% aluminum (four nines) recommended; fully annealed wire with maximum elongation near 30% suitable for direct silicon bonding without metallization
• Optional Indexer: Supports TO-3, TO-220, TO-66, and hybrid power devices; driven by Geneva mechanism for automatic device feeding
• Wire Length Capability: Programmable step-back to 300 mils for resistance spot welding; longer lengths via operator control
