The PCB 483B08 is a bare printed circuit board serving as the foundational substrate for mounting and interconnecting electronic components in functional circuits. Fabricated from dielectric material clad with copper foil, this board provides the mechanical and electrical foundation for diverse applications ranging from prototype development to production systems.
Technical Specifications
• Substrate Material: FR-4 glass-reinforced epoxy laminate; alternative high-frequency or high-speed laminates available for specialized electrical performance requirements
• Copper Weight: Commonly 0.5 oz or 1 oz for inner layers; 1 oz or 2 oz for outer layers (finished)
• Board Thickness: Standard thicknesses include 0.062″ (1.57 mm) and 0.031″ (0.79 mm)
• Trace and Space: Minimum capability down to 4 mils (0.004″)
• Plated Hole Diameter: Minimum finished hole size 246 mils (0.246″)
• Non-Plated Hole Diameter: Minimum 199 mils (0.199″)
• Standard Hole Pitch: 2.54 mm (0.1″)
• Surface Finish Options: HASL (solder), hard gold, immersion gold, immersion silver
• Dielectric Constant (Dk) and Loss Tangent (DF): Values vary by material selection; critical for high-frequency performance
• Glass Transition Temperature (Tg) and Decomposition Temperature (Td): Define performance at elevated temperatures; values material-dependent
– Key Features
• Flexible layer configuration—single-layer, double-layer, or multi-layer designs supported
• Customizable dimensions and form factors cut from larger panels
• Wide range of copper weights and thickness options
• Multiple surface finish choices for solderability and corrosion resistance
– Typical Applications
General-purpose PCB substrate for electronic circuit assembly, prototype boards, and production systems requiring standard FR-4 performance characteristics.
– Compatibility & Integration
Compatibility is determined by the electronic components designated for mounting and the host system requirements. Material selection—particularly substrate type and copper specifications—should align with electrical performance needs and thermal operating conditions.
