The RECIF Technologies TBFF6BF ANA is an automatic wafer notch finder engineered to align batches of wafers by their notch with high precision. This system enhances efficiency and accuracy in semiconductor wafer handling and processing, employing RECIF’s industrialized alignment technology across standalone and OEM platforms. The unit features a password-protected touchscreen interface enabling selection of post-alignment angle and automatic operation upon cassette placement. Operators can access multiple alignment programs including standard mode, thin/compound wafer alignment, and edge-inspection mode. An optional inspection mode permits 360° batch rotation for visual verification.
Technical Specifications
• Model: TBFF6BF ANA (Automated Notch Aligner designation)
• Wafer Size: 200 mm primary design
• Power Requirements: 100/240 V AC, 50/60 Hz, 1.2 A
• Control Interface: Password-protected touchscreen with multiple alignment program selection
• Alignment Programs: Standard mode, thin/compound wafer alignment, edge-inspection mode
• Optional Capability: 360° batch rotation inspection mode
• Cleanroom Rating: ISO 3 (Class 1 FS209E)
• Certifications: CE Marked
• Origin: Manufactured in France
– Key Features
• Batch cassette handling with automatic startup upon placement
• ESD-protected construction with grounded wafer and cassette paths
• Cleanroom-compatible materials and design
• Selectable post-alignment angle positioning
• Extended material compatibility including SiC, GaN, and GaAs wafers
– Typical Applications
Critical semiconductor processes including lithography, deposition, and etching workflows where precise wafer alignment is required prior to further processing steps.
– Compatibility & Integration
Designed for batch alignment workflows within standard cassette handling systems. Product adherence to SEMI standards supports integration into existing semiconductor manufacturing environments.
