The Silicon Thermal CH400 is a compact heat sink engineered for efficient thermal management of electronic components in semiconductor test environments. It operates across a temperature range of -60°C to +150°C and is designed to handle applications where robust heat dissipation is critical to system performance and reliability.
Technical Specifications
• Product Type: Heat Sink
• Manufacturer: Silicon Thermal
• Model: CH400
• Operating Temperature Range: -60°C to +150°C
• Design Form Factor: Compact
– Key Features
The CH400 leverages silicon-based thermal materials and construction to achieve high-performance heat transfer characteristics. Silicon materials exhibit thermal conductivity of approximately 156 W/m·K, while thermal interface materials used in conjunction with heat sinks typically range from 0.8 to 9.5 W/m·K depending on composition and reinforcement. The compact design enables integration into space-constrained applications without sacrificing thermal dissipation capability.
– Typical Applications
• Semiconductor test engineering characterization
• High-volume semiconductor production test environments
• Electronic components generating significant heat requiring efficient removal
– Compatibility & Integration
The CH400 integrates with components and systems requiring active thermal management across the full -60°C to +150°C operating envelope. Its compact geometry supports deployment in test fixtures and production equipment where thermal control directly impacts component reliability and test accuracy.
