The T-Tech TH-VIA-032P via pins establish electrical connections between conductive layers in multi-layer printed circuit boards. Each pack contains 430 individual pins sized at 0.032 inches in diameter, designed for prototyping and small to medium-scale PCB production. These pins bridge different board layers to ensure signal integrity and power distribution while maintaining reliable vertical interconnections across the stackup.
Technical Specifications
Product: T-Tech TH-VIA-032P 0.032-Inch Via Pins
Pin Diameter: 0.032 inch
Quantity per Pack: 430 pins
The 0.032-inch diameter designation specifies the nominal pin size for compatibility with corresponding drilled holes in PCB layouts. This diameter is critical for establishing proper electrical contact and mechanical fit within the via structure.
– Key Features
• Vertical layer interconnection for multi-layer PCB designs
• Fixed diameter of 0.032 inch for standardized hole compatibility
• Bulk quantity of 430 pins per pack for extended prototyping and production runs
• Designed for use with T-Tech Quick Circuit prototyping systems
• Support for fine trace geometries and small-hole PCB designs
– Typical Applications
• Single- and double-sided PCB prototyping
• Small to medium production runs requiring inter-layer connectivity
• Multi-layer PCB construction and signal routing
• Power distribution and electrical signal pathways between board layers
– Compatibility & Integration
These via pins integrate with T-Tech’s Quick Circuit prototyping systems, which support rapid PCB fabrication from design through prototype completion. The 0.032-inch diameter ensures compatibility with standard PCB drilling tolerances and T-Tech system specifications for intricate board designs.
