The Tektronix SMG50 KlipChip Surface Mount Device Interconnects are precision probing adapters that enable direct attachment of logic and analog probes to surface mount devices (SMDs), dual in-line packages (DIPs), and discrete components. This 19-count gray interconnect set provides dual-sided 0.025 inch lead contacts for multi-signal insertion and acquisition, supporting component lead centers on 0.050 inch spacing with maximum lead diameters up to 0.095 inches. Rated for 40 Volts maximum, the SMG50 facilitates signal access during troubleshooting, design validation, manufacturing test, and prototype debug workflows on SMD circuitry.
Technical Specifications
• Model: SMG50
• Quantity per package: 19 units
• Lead contact size: 0.025 inch (dual-sided)
• Maximum lead diameter: 0.095 inches
• Lead center spacing: 0.050 inches
• Voltage rating: 40 Volts maximum
• Color: Gray
– Key Features
• Stackable design on 0.050 inch component pitch
• Dual-sided contact configuration for bidirectional signal access
• Accommodates a wide range of component lead sizes and package types
• Gray polymer body for easy visual identification
– Typical Applications
• Attachment of logic probes and analog probes to test points on SMD assemblies
• Design and prototype debug of surface mount circuits
• Manufacturing test and in-circuit troubleshooting of SMD boards
• Servicing and rework operations on SMD circuitry
• Research and development environments
– Compatibility & Integration
The SMG50 integrates with Tektronix logic analyzers, including the TLA5000 Series, and supports standard probe attachment workflows. For finer-pitch applications below 0.050 inch spacing, the SMK4 Micro KlipChip Adapter is the appropriate alternative. Individual interconnect units are available separately under part number 206-0364-01.
