The West Bond K1200D is a microprocessor-based temperature controller designed for precision die bonding and microassembly operations. It delivers 400 watts of heating power through programmable temperature management and two solid-state relays linked to workholder heating elements. The system enables controlled heating integration with West Bond wire bonders and die bonders—including the 7372E epoxy and eutectic die bonder—making it suitable for prototype development and low-volume production environments.
Technical Specifications
• Control System: Microprocessor-based temperature management
• Power Output: 400 watts (K1200D); 600-watt K1201D model available for larger applications
• Temperature Control: Programmable controller with two solid-state relays for workholder heating elements; minimal setup required
• Calibration: Versatile calibration procedures supporting adjustment of set point, workholder stabilization, and OFFSET temperature input
• User Interface: User-friendly interface enabling quick access to settings and adjustments
– Key Features
• Precise temperature management via solid-state relay switching
• Microprocessor control with programmable settings
• Adaptable calibration for diverse application requirements
• Ergonomic design for operator comfort during extended operation
– Typical Applications
• Temperature control for West Bond epoxy and eutectic die bonders (7372E, 7400E, 7476D series)
• Heated workholder management in die attachment processes
• Inert atmosphere die bonding with cavity workholders
– Compatibility & Integration
The K1200D interfaces with West Bond heated and non-heated workholders. The K1300 Gas Flow Assembly complements West Bond Cavity Inert Atmosphere Workholders for eutectic die attachment. Compatible microscopy systems include Nikon and Olympus ESD-protected options with selectable eyepiece magnifications. The S.M.A.R.T. (Superimposed Microscope Attached Reference Target) assembly attaches to microscope objectives for workpiece positional reference. Integration with West Bond bonding equipment includes wire and die bonder series 7372E, 7400E, and 7476D.
