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Brooks / PRI Automation PRE-300BU-I-CE-SU Pre-Aligner Module

SKU: PRE-300BU-I-CE-SUCategories: Machine Vision Systems
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The Brooks / PRI Automation PRE-300BU-I-CE-SU Pre-Aligner Module is designed for precise wafer alignment in semiconductor manufacturing. This module ensures accurate positioning of wafers before processing, enhancing overall production efficiency and yield. It features robust construction and reliable performance for demanding cleanroom environments.

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$2,800.00

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Precision RF and optical test equipment sales, calibration, and repair by Aumictech. Email: sales@aumictech.com

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Equipment info

The Brooks / PRI Automation PRE-300BU-I-CE-SU Pre-Aligner Module performs precision wafer alignment in semiconductor manufacturing, positioning 200 mm and 300 mm wafers prior to critical processing steps. The system detects notch and flat fiducials on silicon and quartz substrates, achieving ±0.03° rotational accuracy and ±0.1 mm center positioning in under 1.7 seconds. Designed for ISO Class 1 cleanroom environments, it employs vacuum adsorption holding with CCD line sensor and vacuum sensor detection.

## Technical Specifications

• Wafer sizes: 200 mm, 300 mm
• Fiducial recognition: Notch and flat detection
• Material compatibility: Silicon, Quartz
• Alignment accuracy: ±0.03° rotation, ±0.1 mm wafer center
• Alignment time: <1.7 seconds
• Rotational extent: Unlimited
• Holding method: Vacuum adsorption
• Detection: Vacuum sensor and/or CCD line sensor
• Drive motor: AC servo motor with 20-bit incremental encoder (AC 200V)
• Clean class: ISO 1
• CDA requirement: 0.24–0.26 MPa (34.8–37.7 psi) at 1.5 L/min
• Vacuum requirement: −80 to −70 kPa at 2 L/min
• Mass: Approximately 7 kg

## Key Features

**Optical System** — 325 nm laser and white light package with four objectives (5x, 50x, 100x, 150x) plus 325 nm 100x UV objective. High-resolution color CCD camera with 24-bit white light package delivers on-screen magnification to 20,000x. Confocal microscope capability with <0.15 µm feature resolution.

**Wafer Handling** — Integrated 300 mm wafer handler with 300 mm Asyst Loadports and Hermos carrier ID readers.

## Automation and Integration

• SEMI standards: E84, E87, E40, E90, E94 compliant
• GEM/SECS: E4, E5, E30 support
• Interface options: NFS Ethernet, Tencor File Format, KLARF
• Configuration: Manual to fully automated operation
• Features: Cassette loading, wafer deskew, defect inspection, image capture, data storage, network command capability
• Impact ADC option available

## Compatibility & Integration

Also recognized under KLA Tencor / ASD part number 0029191-000. Supports locally stored recipe-based operation and networked remote command execution.

MPN

PRE-300BU-I-CE-SU

Voltage / Current Range

AC 200V

Wavelength Range

325 nm

Brand Name

Brooks / PRI Automation

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