The Curtiss-Wright/DY-4 SVME-177 is a ruggedized single VMEbus module computer that consolidates processor, memory, and multi-protocol I/O onto one board for demanding embedded defense, aerospace, and industrial applications. Built around a PowerPC 603e RISC CPU operating at 100 MHz, it delivers integrated computing capability without requiring stacked modules.
## Technical Specifications
**Processing & Memory**
• PowerPC 603e RISC CPU at 100 MHz
• Up to 64 Mbytes DRAM with Error Detection and Correction (EDAC)
• 8 Mbytes 64-bit Flash EPROM for applications
• 2 Mbytes boot Flash EPROM
• 256 Kbytes EEPROM
• 512 bytes serial EEPROM for configuration storage
• Burst performance: 5.3/3.3 Mbytes/second (EDAC off); 6.4/4.4 Mbytes/second (EDAC on)
**VMEbus Interface**
• A32:D32 VMEbus with A64:D64 MBLT support (ANSI/VITA 1-1994, VME64)
• Advanced VME Interface Chip (SCV64) with location monitor and FIFO buffer
• Bus Isolation mode (BI-mode®), Auto-ID, and Auto-SYSCON capabilities
• System controller functions
**On-Board Communications**
• Ethernet (AUI interface)
• SCSI-2 single-ended, 8-bit wide: 5 Mbytes/second asynchronous or 10 Mbytes/second synchronous
• Two EIA-422 serial channels: 75 to 38.4K bps asynchronous; 613K bps synchronous (1M bps with DMA)
• Two EIA-423 serial channels: 75 to 38.4K bps programmable rates
• Four 16-bit counter/timers
## Key Features
• Conduction-cooled per IEEE 1101.2 (0.80-inch pitch) for MIL-E-5400/4158 environments
• 95% fault coverage Built-In-Test (BIT) with results stored in RAM
• MAXPack mezzanine expansion support for flexible I/O enhancement
• Programmable low-power operating modes
• Foundation firmware: debug monitor, diagnostics, Card Support Services, Execution Sequencer, Non-Volatile Memory Programmer, and FlashProg in-circuit programming utility
## Typical Applications
Defense systems, airborne platforms, and industrial control environments requiring integrated computing and multi-interface connectivity on a single VME module.
## Compatibility & Integration
DRAM accessible from CPU, VMEbus, SCSI, Ethernet, and MAXPack interface. Compatible with both air-cooled and conduction-cooled baseboards.
