The Disco Abrasive Systems DAD-2H/6T is an automatic dicing saw for precision cutting, grooving, and slotting of semiconductor wafers and advanced materials. Engineered for high-accuracy R&D and production environments, the system delivers programmable cutting parameters, multi-axis servo control, and motorized workpiece positioning. A 1250 W air bearing spindle operating at 15,000 to 40,000 rpm provides cutting power across wafer sizes up to 160.4 mm diameter. The machine accommodates blade sizes to 76.2 mm and supports four preset cutting modes plus custom program storage.
## Technical Specifications
**Spindle & Cutting Performance**
• Spindle speed: 15,000–40,000 min⁻¹
• Air bearing spindle: 1250 W, 1.5 kW output
• Z-axis vertical stroke: 20 mm
• Maximum cutting stroke (ø2″ blade): 26.7 mm
• Return clearance: 0.7 mm
• Maximum blade diameter: 76.2 mm (3″)
**Workpiece Handling**
• Maximum workpiece diameter: ø160.4 mm (6″)
• X-axis stroke: 330 mm maximum; 164 mm usable
• Y-axis indexing step: 0.0005 mm
• Z-axis minimum step: 0.0001 mm
• Theta-axis rotation: 0–150 degrees (motorized 360° capable)
• Linear guide bearing with DC servomotor drive and air guide
**Positioning Accuracy**
• Y-axis cumulative pitch accuracy: <0.003 mm/160 mm
• Y-axis single pitch accuracy: <0.003 mm/5 mm
• Z-axis repeating accuracy: 0.001 mm/5 mm
• Spindle index range: 0.0001" to 4" in 0.0001" increments
**Feed & Speed Control**
• Cutting feed speed: 0.04–300.0 mm/s
• Indexing speed: 30 mm/s
• Depth control: 0.005–19.995 mm in 0.005 mm increments
**Vision & Alignment**
• CCD camera with 5" monitor
• x120 magnification alignment microscope
• 40 mm scope with eyepiece; 20 mm objective span scope
• Split field microscope capability
**Electrical & Utilities**
• Power supply: 3-phase 200 V, 50/60 Hz
• Power consumption: 3–3.50 kVA
## Key Features
• Dual-spindle capable with independent axis control
• Ten programmable cutting job storage
• Manual, semi-automatic, and full-automatic operation modes
• Four fixed cutting modes (A, B, C, D) plus custom programming
• Motorized chuck with theta rotation for angular positioning
## Typical Applications
• Semiconductor wafer dicing and precision slotting
• Research and development cutting trials
• High-volume production dicing operations
• Advanced material substrate processing
## Compatibility & Integration
The DAD-2H/6T operates on standard industrial three-phase power and integrates with laboratory and production floor environments supporting wafer diameters from 2" to 6" using interchangeable blade assemblies.
