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Sikama FALCON-8500

SKU: FALCON-8500Categories: Environmental Test Chambers
Brand: Sikama
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The Sikama FALCON-8500 is a high-performance reflow oven designed for soldering electronic components onto printed circuit boards (PCBs). It provides precise temperature control and uniform heat distribution, ensuring high-quality solder joints. Ideal for various SMT assembly applications, it offers a reliable and efficient solution for electronics manufacturing.

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Equipment info

The Sikama FALCON-8500 is a production-scale reflow solder and curing oven engineered for high-performance SMT assembly and thermal processing. It combines conduction heating with forced thermal convection to deliver precise, uniform temperature control across diverse substrate types and component geometries. The system handles wafer bump reflow, BGA soldering, high-mass components, and epoxy curing processes including underfill and glob-top applications.

Technical Specifications

• Maximum Temperature: Up to 400°C
• Temperature Uniformity: ±2°C across chamber zones
• Chamber Volume: 8 cubic feet
• Total Thermal Capacity: 15 kW
• Chamber Configuration: 1 load zone (liquid-cooled), 5 heat zones with individual gas flow control, 2 cooling zones (internal liquid-cooled and external offload)
• Heating Technology: Conduction heating with forced thermal convection
• Atmosphere Support: Air, nitrogen, or forming gas operation
• Maximum Substrate Dimensions: 8″ (length) × 11″ (width)
• Wafer Compatibility: 4″ to 12″ wafers; 6″ to 12″ require no tooling change; 200 mm (8-inch) reflow systems supported

– Key Features

• Dual transport options: sweeper bars (continuous or dwell mode) and walking beam systems
• Liquid-cooled load and offload zones for rapid thermal stabilization
• Individual setpoint control for each of five heat zones
• Polyimide door liner with ceramic fiber insulation
• Stainless steel corrosion-resistant frame construction
• SMEMA interface for automated production line integration
• Optional Windows-based software for profile storage, temperature monitoring, data logging, and remote operation
• Thermocouple installation points for temperature profiler integration

– Typical Applications

• Reflow soldering and BGA assembly
• Wafer bump reflow (3–8 inch diameter)
• High-mass and die soldering
• Epoxy curing and underfill processes
• Glob-top curing
• Sintering and thermal treatments
• Insulated metal-core substrate processing

– Compatibility & Integration

The FALCON-8500 meets CE certification, SEMI safety and ergometric standards, and UL/CSA electrical requirements. SMEMA interface enables seamless connection to existing production lines. Optional computer control via Windows software supports remote monitoring and historical data retrieval. The system accommodates diverse substrate materials and custom fixtures within specified dimensional limits.

MPN

FALCON-8500

Brand Name

Sikama

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