The Sikama FALCON-8x5C is a compact desktop reflow oven for precision PCB assembly, prototype development, and low-volume production. It delivers controlled thermal profiles through a hybrid heating architecture combining conduction heat from below with convection heat from above across seven process zones. The system maintains ±2°C temperature accuracy and zone uniformity while operating in air, nitrogen, or forming gas atmospheres at oxygen levels as low as 10 PPM, making it ideal for fluxless and inert-atmosphere soldering applications.
Technical Specifications
Thermal Architecture
• Seven process zones: four heating, two cooling, one loading
• Maximum temperature: 400°C (752°F)
• Temperature accuracy: ±2°C
• Zone-to-zone uniformity: ±2°C
• Dual heating method: bottom conduction and top convection
• Two dedicated cool-down zones with liquid cooling
Substrate Capacity
• Maximum substrate dimensions: 5 inches × 5.75 inches (127 mm × 146 mm)
• Platen size: 5 inches × 6.5 inches (125 mm × 162 mm)
• Maximum substrate weight: 1 lb (0.45 kg) using all zones
• Maximum substrate height: 3.5 inches (89 mm)
Transport & Process Control
• Sweeper bar transport system with dwell-mode zone stops
• Bi-directional process flow (left-to-right or right-to-left)
• Adjustable top platens minimize chamber opening (as low as 0.25 inch)
Atmosphere Control
• Compatible gases: air, nitrogen, or forming gas (N₂/H₂ mixture)
• Minimum O₂ level: 10 PPM
• Inert gas delivery via adjustable orifices in top heated platens
– Key Features
• Compact desktop footprint minimizes facility requirements
• Liquid-cooled loading and offload platforms for rapid thermal cycling
• Internal liquid-cooled zone enables process cool-down in inert atmosphere
• Top platen adjustment prevents flux contamination between zones
– Typical Applications
• Fluxless gold or tin reflow
• BGA singulated ball reflow
• Fixtured double-sided board assembly
• Large microwave component soldering
• Epoxy curing, underfill, and glob-top processes
• Multi-substrate material compatibility
– Compatibility & Integration
Manufacturer: Sikama International
