The Solid State Cooling Systems Thermorack 650 is a 19-inch rack-mountable recirculating chiller that delivers 650 W of cooling capacity using thermoelectric technology. Operating without compressors or refrigerants, it provides precise temperature control with ±0.05°C stability and repeatability, making it ideal for sensitive electronic equipment, lasers, and analytical instruments in data centers, telecommunications facilities, and laboratories.
Technical Specifications
Cooling Performance
• Cooling capacity: 650 W @ 20°C coolant temperature, 20°C ambient air, 220 VAC
• Temperature control range: 5°C to 50°C (standard); optional low-temperature configuration to -5°C; optional high-temperature configuration to 65°C
• Stability/repeatability: ±0.05°C at constant load
• Flow rate: 1 to 3 liters per minute (standard)
• Internal thermoelectric module lifespan: > 200,000 hours
Environmental Operating Conditions
• Ambient temperature range (standard): 0°C to 40°C non-condensing
• Extreme ambient option: -10°C to 70°C non-condensing
• Process fluid options: Koolance (27% propylene glycol/water), 27–50% ethylene glycol/water, or specialty fluids (Fluorinert, Galden, Opteon SF10)
Electrical
• Power input: 650 W @ 220 VAC; 540 W @ 120 VAC (both 20°C coolant, 20°C ambient)
• Universal voltage input: 100–240 VAC, 50/60 Hz
– Key Features
• PID control for cooling and heating
• Temperature cycling with adjustable soak time and cycle count
• Auto restart function
• Variable speed fan
• Multiple communication interfaces: keypad, RS232, RS485, Ethernet, TTL
– Physical Specifications
• Form factor: 19-inch EIA-310-C rack-mount
• Dimensions: 11″ × 14.5″ × 13″ (28 × 37 × 33 cm)
• Weight: Approximately 33 lbs (15 kg) drained
• Rack rail requirement: Minimum 16 inches in length
• Wetted materials: Aluminum, copper, or stainless steel (configuration-dependent)
– Compatibility & Integration
Designed for EIA-310-C standard 19-inch electronics racks. Supports multiple industrial communication protocols and control interfaces for integration into automated test and environmental chamber systems.
