The UC170 is an ultra-compact, air-cooled recirculating chiller built on thermoelectric (Peltier) cooling technology. It delivers 170 W of cooling capacity at 20°C ambient and maintains ±0.1°C temperature stability with constant load, making it ideal for precision thermal management in space-constrained and noise-sensitive environments. Operating without compressors or refrigerants, the UC170 integrates into OEM equipment, laboratory instruments, and analytical systems requiring rapid thermal response and reliable performance.
Technical Specifications
• Cooling Technology: Thermoelectric (Peltier effect)
• Cooling Capacity: 170 W @ 20°C ambient
• Operating Temperature Range: 10°C to 45°C
• Ambient Temperature Range: 10°C to 40°C non-condensing
• Temperature Stability: ±0.1°C with constant load
• Process Fluid Compatibility: Koolance (27% propylene glycol/water), 27–50% ethylene glycol/water mixtures
• Process Fluid Fittings: 1/8″ female CPC quick connect with shut-off valve
• Pump: Magnetically-coupled gear pump with brushless DC motor; G3 option (500 ml/min @ 10 psig), G1 option (450 ml/min @ 10 psig), G3M option (~0.7 lpm)
• Process Fluid Flow Rate: ~0.45 lpm @ 10 psig (G3/G1); ~0.7 lpm @ 10 psig (G3M)
• Tank Volume: 75 ml with optional level sensor and sealable cap
• Wetted Materials: Aluminum + polymers or Copper + polymers
• Noise Level: < 63 dBA @ 1 m
• Power Input: 100–240 VAC, 50/60 Hz, 2.8 A max
• Operating Voltage: 13.5 VDC, 15 A max
• Power Consumption: < 200 W
• Dimensions: 7.5" × 5" × 7" (19 cm × 13 cm × 18 cm)
• Weight: 8 lbs (3.5 kg); 10 lbs (4.5 kg) with copper wetted materials
– Key Features
• Digital PID controller for heating and cooling with keypad interface
• RS232 communications for remote monitoring and control
• Temperature, fluid level, and system failure alarms via display, RS232, and dry contact outputs
• Magnetically-coupled pump eliminates dynamic seal wear
• Included 200 W, 13.5 VDC table-top power supply with universal input
– Typical Applications
• Plasma etch and reactive ion etch systems (Plasma Prep series, RIE 2000)
• Low-light CCD camera cooling
• Diode laser thermal stabilization
• Analytical instruments and lab automation
• Microtiter plate temperature control
• Point-of-use thermal management
– Compatibility & Integration
The UC170 integrates into OEM medical devices, electronics cooling applications, and laboratory equipment where compact form factor and low acoustic output are essential. Dual wetted material options (aluminum or copper) accommodate specific fluid chemistry and heat transfer requirements.
