The West Bond K-1010 is a microprocessor-based temperature controller designed for precision heating control in microelectronics assembly and bonding applications. It regulates work holder heating elements via solid-state relays, delivering accurate thermal management with minimal setup overhead. The K-1010 integrates into West Bond’s wire bonder and die attach systems, enabling eutectic die attachment and complementary bonding processes across manual and semi-automatic equipment platforms.
Technical Specifications
• Model: K-1010 temperature controller
• Power Rating: 400 watts (600-watt K-1201D variant available for larger applications)
• Control Architecture: Microprocessor-based with solid-state relay interface to work holder heating elements
• Programmability: K-1200D programmable controller variant shares K-1010 designation and functionality
– Key Features
• Precise temperature control with integrated microprocessor regulation
• Solid-state relay switching for reliable, flexible heating element control
• Minimal setup time for integration into existing bonding systems
• Compatibility with multiple power ratings to support varying application scales
– Typical Applications
• Eutectic die attachment with West Bond Cavity Inert Atmosphere Workholders
• Temperature-critical bonding processes requiring stable work holder heating
• Integration into wire bonder and die attach assembly lines
– Compatibility & Integration
The K-1010 operates within West Bond’s manual and semi-automatic wire bonder series, including 7KE and 4KE systems. It interfaces with work holder assemblies and supports bonding operations including 45° wedge, 90° feed for wire and ribbon, and ball bonding. Work platforms range from 11″ × 11″ (280 mm × 280 mm) to optional 20″ × 20″ (508 mm × 508 mm) configurations. Bonding wire diameters from 0.7 to 3 mil (18 to 75 μm) and ribbon cross-sections are supported. West Bond’s patented single-input X-Y-Z micromanipulator architecture enables versatile positioning with unlimited part size accommodation.
