The Agilent/Keysight 44473A is a 4×4 two-wire matrix switch module that enables flexible signal routing and instrument interconnection across multiple test points. This module permits any combination of inputs and outputs to be connected, supporting complex measurement configurations where multiple instruments require simultaneous access to a Device Under Test (DUT).
Technical Specifications
Switching Matrix
• Configuration: 4×4 two-wire matrix
• Maximum voltage: 250V
• Maximum current per channel: 2A
• Maximum current per module: 8A
• Maximum power per channel: 60W; 125VA
• Maximum power per module: 240W; 500VA
• Initial closed channel resistance: <1 Ω
• Thermal offset: <3µV
• Scan rate: 43 channels/second
• Relay mechanical life: 10⁸ cycles
Mechanical & Environmental
• Dimensions: 15 × 12 × 9 inches
• Weight: 2 lbs
• Operating altitude: up to 3,000 meters
• Termination: Screw terminal block
– Key Features
Low channel resistance below 1 Ω minimizes signal degradation during switching operations. Thermal offset specification of <3µV supports precision DC and low-level signal measurements. The module sustains 10⁸ mechanical relay cycles, providing extended operational life in demanding test environments. High scan rate of 43 channels/second accelerates test throughput when sequential switching is required.
– Typical Applications
This matrix switch excels in automated test equipment (ATE) configurations, data acquisition systems requiring multiplexed signal routing, and laboratory environments where DUT characterization demands multi-point simultaneous instrumentation. The 250V maximum rating and 2A per-channel capacity accommodate both low-level signal switching and moderate power applications.
– Compatibility & Integration
The 44473A installs directly into Agilent/Keysight 3488A and 3499A/B/C mainframes. Screw terminal interconnection provides straightforward integration with external cabling. The optional 44483A Terminal Block accessory simplifies module-to-DUT connections. Operation verification testing is recommended prior to performance validation to confirm module operability before conducting DC isolation and thermal offset measurements.
