The Keysight/Agilent/HP 81002-68705 Part II is a thermal management heatsink accessory engineered for the Agilent 81002FF Integrating Sphere and Agilent 81628B Optical Power Head. It dissipates heat generated during high-power optical measurements, maintaining stable operating temperatures and preventing thermal runaway that could compromise measurement accuracy and device longevity.
## Technical Specifications
• **Product Designation:** 81002-68705 Part II
• **Primary Function:** Thermal dissipation for coupled optical measurement devices
• **Thermal Management:** Actively manages heat during sustained high-power operation
## Key Features
• Prevents thermal-induced performance degradation in integrated measurement systems
• Maintains stable operating conditions critical for high-power optical testing
• Designed for operation in systems handling optical power levels to +40 dBm (10 W)
• Supports thermal stability above +34 dBm (2.51 W), where metal part temperature limits become a design constraint
## Compatibility & Integration
**Agilent 81002FF Integrating Sphere**
The 81002FF accommodates high optical power measurements up to +40 dBm (10 W) with integrating sphere geometry. Compatible with Agilent 8163A, 8166A, and HP 8153A Lightwave Multimeters. Accepts large emission sources and high numerical aperture (NA) inputs to 0.5.
**Agilent 81628B Optical Power Head**
This sensor head is rated for high-power measurements to +40 dBm and incorporates a built-in integrating sphere. Standard configuration uses threaded type adapters; removing the adapter exposes an 8 mm diameter aperture for open-beam or custom fiber holder configurations. Interfaces with 816x mainframes through 81618A or 81619A interface modules. Thermal management becomes essential during sustained operation above +34 dBm, where metal component temperature limits apply.
The 81002-68705 Part II heatsink directly addresses thermal constraints in both devices, ensuring measurement repeatability and instrument protection during extended high-power operation.
