The Orbotech Symbion S36 is a 2D Automated Optical Inspection system engineered for PCB quality assurance across SMT, through-hole, and mixed-technology production environments. It delivers real 3-D imaging with advanced DPIX technology to detect and classify defects in solder joints, component placement, polarity, and presence verification. The system inspects passive and active components down to 01005 size and 0.3 mm pitch, handling boards up to 550 × 470 mm with automatic warp compensation and conveyor adjustment.
Technical Specifications
• Inspection Type: Pre- and post-reflow SMT, through-hole, and mixed technologies
• Component Detection: Presence/absence, placement accuracy, polarity, OCR, odd-form components, and connectors (down to 0402 size; 01005 in select configurations)
• Solder Defects: Insufficient solder, tombstone, billboard, coplanarity, lifted leads, shorts
• Imaging: Real 3-D with 95 images per field of view; 5-camera primary configuration (7.2-megapixel or 4-megapixel DALSA TOP); up to 4 additional side-verification cameras
• Resolution: 25 µm; pixel size selectable at 18 µm, 25 µm, or 29 µm
• Illumination: Axial, direct, diffuse, and RGB multi-color
• Inspection Speed: Up to 40 cm²/sec or 60 cm²/sec
• Board Capacity: Maximum 550 × 470 mm (21 × 18 in.)
• Clearance: 90 mm under camera and board; 2 mm top / 3 mm bottom edge clamping; up to 90 mm board underside
• Operating System: Windows XP Professional, Windows 10, or Windows 10 Server
– Key Features
• Automatic board warp compensation and conveyor width adjustment
• Symmetric image acquisition with color capability
• High-resolution multi-camera architecture for defect classification accuracy
• Flexible inline and offline deployment
– Typical Applications
• Quality assurance in high-volume PCB manufacturing
• Pre- and post-reflow inspection in SMT lines
• Mixed-assembly verification for consumer, industrial, and telecom boards
– Compatibility & Integration
Designed for integration into production workflows requiring both high throughput and detailed defect analysis on standard conveyor systems.
