The SIGMA TP2477M is an industrial thermal platform engineered for precise temperature control across demanding test and conditioning applications. It delivers rapid thermal transitions and dual control modes—System and Device Under Test (DUT)—enabling efficient characterization of low-profile, flat-surface components. The open work surface accommodates RF devices, IGBTs, MOSFETs, and other thermally conductive devices requiring repeatable thermal cycling and environmental stress screening.
Technical Specifications
Work Surface: 14 inches × 24 inches open platform
Temperature Control Systems:
• Compressor-based (Single Stage): -30°C to +200°C
• Compressor-based (Cascade): -60°C to +200°C
• Liquid Nitrogen cooled: -100°C to +200°C
• Liquid Carbon Dioxide cooled: -65°C to +200°C
• Extended ranges available upon request
Thermal Performance: Temperature transitions up to 100°C/min. Dual control modes optimize either system stability or rapid device temperature attainment.
– Key Features
• Open work surface for direct device contact
• Selectable refrigeration: compressor, cryogenic (LN₂), or CO₂ systems
• System and DUT control modes for flexible testing protocols
• Custom hole patterns and threaded inserts (NC, NF, metric)
• Adapter and fixturing plates available
• Platform covers for environmental isolation and worker protection
– Typical Applications
Thermal cycling and stress testing of RF power devices, discrete semiconductors, integrated circuits, and power modules. Suitable for reliability qualification, burn-in conditioning, and temperature-dependent parameter characterization.
– Compatibility & Integration
The TP2477M integrates with Sigma Systems TS and TSR series controllers, both offering touch-screen interfaces, real-time performance graphing, independent fail-safe diagnostics, and multiple communication protocols. The TSR controller maintains backward compatibility with legacy Sigma Systems C, CC3, CC3.5, and C4 control platforms, enabling seamless retrofit into established test environments.
