The NI PCI-8330 MXI-3 Interface Module establishes high-speed communication between a host computer’s PCI bus and external PXI or CompactPCI systems. Operating as a PCI-to-PCI bridge, this module delivers transparent hardware and software connectivity—devices on the secondary bus appear as local devices, eliminating driver rewrites. The MXI-3 serial link supports 1.5 Gbit/s data rates with peak throughput of 132 Mbytes/s and sustained performance of 84 Mbytes/s.
Technical Specifications
• Data Link Rate: 1.5 Gbit/s serial data
• Peak Performance: 132 Mbytes/s
• Sustained Performance: 84 Mbytes/s
• Maximum Buses: Up to 255 (BIOS dependent)
• Power: +5 VDC @ 1.5 A
• Operating Temperature: 0 °C to 50 °C
• Storage Temperature: −20 °C to 70 °C
• Operating Humidity: 10% to 90% non-condensing
• Storage Humidity: 5% to 95% non-condensing
• MTBF: 1,130,000 hours
• PCI Module Dimensions: 4.2 × 6.9 inches; 0.33 lb
• PXI Module Dimensions: 3.9 × 6.3 inches; 0.33 lb
– Key Features
• Transparent PCI bus extension via MXI-3 technology maintains full hardware and software compatibility
• Dual connectivity: copper cables (10 m) or fiber-optic cables (200 m)
• Supports daisy-chain and star network configurations
• Dual-module expansion enables PXI/CompactPCI chassis extension with automatic primary/secondary bus assignment
• Complies with PCI-to-PCI Bridge Architecture Specification v1.0 and PCI Specification Revision 2.1
• HSSDC receptacle for serial link connectivity
– Typical Applications
• Multi-chassis PXI system integration
• Extended CompactPCI deployments requiring electrical isolation
• High-speed modular instrumentation networks with legacy PCI host systems
– Compatibility & Integration
OS-independent operation across Microsoft Windows, Apple Mac OS, and Sun Solaris. Supported by NI-VXI and NI-VISA drivers. Automatically configures as primary or secondary interface when two modules are installed in a single chassis.
