The Mini-Circuits TIA-1000-4 is a high-power RF instrument amplifier engineered for test and laboratory applications across the 100 MHz to 1000 MHz band. Built into a standalone chassis with integrated power supply, it delivers robust gain and output power performance while maintaining stable operation across demanding measurement scenarios. The amplifier features 50 Ohm impedance, internal thermal protection with LED indication, and is rated for 110V/220V AC operation at 50/60 Hz.
Technical Specifications
Frequency & Impedance
• Frequency range: 100 MHz to 1000 MHz
• Impedance: 50 Ohms
Gain & Output Power
• Gain flatness: ±1.5 dB minimum; ±2.5 dB maximum
• Maximum output power (3.5 dB compression): 42 dBm typical
• Maximum output power (1 dB compression): +36 dBm typical
• Maximum input power (no damage): +25 dBm
Dynamic Performance
• Noise figure: 2.5 dB typical
• Third-order intercept point (IP3): +48 dBm typical
• Reverse isolation: 55 dB typical
Input/Output Matching
• VSWR (350–1000 MHz): 2.5:1 typical at both input and output
Power & Environmental
• AC supply: 110V/220V, 50/60 Hz; 400 VA maximum consumption
• Operating temperature: 0°C to 55°C
• Storage temperature: −40°C to 70°C
• Gain and output power degrade approximately 1 dB over temperature
– Key Features
• Standalone instrument with built-in power supply
• High reverse isolation (55 dB typical) for measurement fidelity
• Thermal self-protection with LED indicator
• 100% burn-in screening at +25°C for 48 hours
• BNC connectors
• Aluminum alloy chassis with grey paint finish
• Dimensions: 19.5 × 6.0 × 12.5 inches (495.3 × 152.4 × 317.5 mm)
• Weight: Approximately 9500 grams (20.9 lbs)
• U.S. Patent 5,101,171
– Typical Applications
• RF system characterization and gain measurement
• Communication system signal conditioning
• Advanced test and measurement setups
• Research laboratory amplification
– Compatibility & Integration
Connector type: BNC. Open-load operation is not recommended; derate maximum input power by 20 dB when operating without a load. Maintain clear airflow around case ventilation openings.
